Bonded soft ferrite using the injection molding has been expected for many applications because it is in conformity with the miniaturization and complicated shape in the electronic devices. However, the electronic devices recently need the bonded soft ferrite having high thermal resistance and bending strength. We examined the difference of characteristics between the polyamide resin/ferrite compound and the polyphenylene sulfide resin/ferrite compound, and also made clear the relation between fludity, permeability μ', bending strength and additional quantity of binder resin in the PPS resin/ferrite compound mixed with three kinds of NiCuZn ferrite powders whose size distribution was different. As the result, the molded chokecoil device having superior electric properties was obtained using the optimum injection molding of NiCuZn ferrite compound.