粉体および粉末冶金
Online ISSN : 1880-9014
Print ISSN : 0532-8799
ISSN-L : 0532-8799
積層形複合チップ部品におけるNiCuフェライトと非磁性材料の反応
熊谷 好吉鈴木 孝志斎藤 諭野村 武史
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1994 年 41 巻 6 号 p. 676-680

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Electromagnetic properties of composite multilayer chip components was studied with special reference to the chemical reaction between magnetic and non-magnetic materials. It has been shown that mutual diffusion between magnetic NiCu ferrite and non-magnetic CuZn ferrite brought about the formation of high, u, NiCuZn ferrite layer, which caused the deterioration of Q-factor. Non-magnetic material of Ni-Cu-Mg-Si-O system has been newly developed for high performance composite multilayer chip components.

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