Technical Information - Special Issue - Recent Evaluation Methods on Micro-Joints -Reliability Testing and Life Time Estimation-
Strain Measurement in Micro-Electronic Packages using the Digital Image Correlation Method
Toru IKEDA, Toshifumi KANNO, Nobuyuki SHISHIDO, Noriyuki MIYAZAKI, Hiroyuki TANAKA, Takuya HATAO
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2010 Volume 79 Issue 3 Pages 237-242
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Article 1st page
