Creep-Fatigue Life Assessment for Sn-3.0Ag-0.5Cu Solder

Abstract

This paper describes the creep-fatigue life assessment of Sn-3.0Ag-0.5Cu solder under pull-push loading using fast-fast, fast-slow, slow-fast and strain-hold strain waveforms. Strain controlled creep-fatigue tests were carried out using solid bar specimen, and the effect of strain waveform on the creep-fatigue life was discussed. Creep-fatigue damage was evaluated by the linear damage rule, the frequency modified fatigue life, the ductility exhaustion model, the strain range partitioning method and the grain boundary sliding model. The strain range partitioning method and the grain boundary sliding model only predicted the creep-fatigue lives within a small scatter.