Abstract
The substrate material for electronic devices is manufactured using a multi-wire saw. These materials must be sliced in large amounts and with a high degree of accuracy. Therefore, rocking vibration-type multi-wire saws with a diamond wire tool have attracted attention by wafer makers. In such vibration multi-wire saws, the rocking vibration has a marked influence on the slicing characteristics. This study was performed to clarify the slicing mechanism of vibration slicing and the relations between vibration conditions and slicing properties. Processing was performed with different angular amplitudes of rocking vibration, and the wafer surface properties after processing were measured.
