Experimental Evaluation of the Stress Intensity Factor Using the Phenomena of Grain Growth and Slip-initiation in Copper Foil

Abstract

In order to evaluate the stress intensity factor of Mode I crack, the grain growth in an electrodeposited copper foil and the slip-initiation phenomena in a recrystallized foil are applied. Taking note of the fact that these phenomena are controlled by shearing stress amplitude, the crack opening displacement and the stress concentration near the crack tip region in a center cracked plate made of carbon steel are measured by applying these foils bonded to it. The stress intensity factor calculated with use of measured values is in rather good agreement with numerical solution. It is concluded that these methods can be applied for evaluating the stress intensity factors of Mode I cracks.