The Proceedings of The Computational Mechanics Conference
Online ISSN : 2424-2799
2024.37
Session ID : OS-0905
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Prediction of the Relaxation Behavior of Ultraviolet Curable Adhesive during Curing Process by Cure Shrinkage Stress Simulation
*Takumi OGURIYoshiharu KARIYAKoji YAMAMOTO
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Abstract

The relaxation behavior of UV adhesives during curing was measured by dynamic viscoelasticity tests during continuous UV irradiation. The results showed that the UV adhesives reached the gelation point at about 0.1 degrees of cure, changed to a gel state from 0.1 to 0.8 degrees of cure, and from a gel state to a solid state after 0.8 degrees of cure, with a large relaxation process in the initial gel state. It was found that there is a large relaxation process in the initial gel state. This behavior was investigated using a general purpose FEM code which implements an originally developed cure shrinkage stress calculation and it was predicted that the viscoelastic master curve moves to the high modulus and long time side with a decreasing gradient in the relaxation zone as the material progresses from liquid to gel to solid.

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© 2024 The Japan Society of Mechanical Engineers
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