The Proceedings of Conference of Chugoku-Shikoku Branch
Online ISSN : 2424-2764
2009.47
Session ID : 122
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122 Application as a chip for solder of Fe/Al_2O_3 and Fe/Si_3N_4 compound material
Kenta Hayashi, Taro Tokuda, Mitsuo Kido
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© 2009 The Japan Society of Mechanical Engineers
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