抄録
In design phase, it is difficult to evaluate the influence of heat density distribution by non-uniform current density on temperature distribution of conductive parts. Therefore, we are developing an electromagnetic field ? thermal flow coupling analysis system. In this research, we developed a physical quantity mapping technique for electromagnetic field - thermal flow coupling analysis. Conventionally, temperature distribution of conductive parts is evaluated by thermal flow analysis under the condition of uniform heat density. In this research, heat density is calculated by finite element method, and thermal fluid field is calculated by voxel method. We developed a technique of mapping heat density onto thermal fluid field. In the technique, defining points and units of finite element are converted to defining points and units of voxel. We compared temperature evaluated by thermal flow analysis under the condition of non-uniform heat density with uniform heat density. As a result, it is confirmed that we can evaluate the influence of heat density distribution on temperature distribution of conductive parts.
