Abstract
Recent developments in the precision grinding technology of advanced ceramics and silicon wafer have been remarkable. However, ceramics swarf floating in grinding fluids causes scratches on the ground surface, deteriorating the surface finish. Ceramic swarf is extremely fine hard nonmagnetic substance and this shape is relatively particulate with low specific gravity. Therefore, the removal of ceramic swarf by the conventional filtration system becomes very difficult. In this report, the experimental analysis of the cross-flow microfiltration of grinding fluids was examined and the flactional void of cake layer in cross-flow microfiltration was clarified. The influences of filtration pressure, abrasive grain diameter on the fractional void was examined.
