主催: 一般社団法人 日本機械学会
会議名: 日本機械学会 関西支部第93期定時総会講演会
開催日: 2018/03/12 - 2018/03/13
In order to develop electron devices, various engineering materials such as polymers and metals are modeled to carry out CAE analysis to evaluate those strength. In this study, a series of tension tests for PC/ABS, SUS304, and so on were carried out within a wide range of strain rate from 10-2 to 102 s-1. Then, the practical material models for those were made by taking the strain rate dependence into consideration and were applied to the dynamic FEM analysis of a smart phone to estimate the effect of the accuracy of material model on the dynamic response of the device.