The Proceedings of Conference of Kyushu Branch
Online ISSN : 2424-2780
2019.72
Session ID : B44
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Development of a device for thermal conductance control using liquid metal
*Kenshi KAMADAKoji MIYAZAKITomohide YABUKI
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Abstract

In this study, we investigate thermal conductance switching characteristics using liquid metal gallium indium eutectic alloy. Gallium indium eutectic alloy was fabricated by mixing gallium and indium. Liquid metal is poured into the micro channel saturated with electrolyte aqueous solution which is driven by applying electric field and known as electrowetting. The filling rate of liquid metal in the action part can control thermal conductance. Thermal switching using electrowetting process shows that the highest value of thermal conductance ratio was about 1.6 for our liquid metal. In the future, we will be developing high efficient device using MEMS technique.

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© 2019 The Japan Society of Mechanical Engineers
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