The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2012
Session ID : GS23
Conference information
GS23 Evaluation of strength degradation of silicone glue under high-humidity conditions
Taisuke SUEDADaisuke ECHIZENYAHiroo SAKAMOTO
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CONFERENCE PROCEEDINGS FREE ACCESS

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Abstract
Adhesive joint is increasingly used for products, because it is possible to apply the joint to various materials and to joint of different materials. Because of plastic adhesives, it is predicted that the significant decrease of strength of the adhesive joint happens depending on the environmental conditions such as high-temperature or high-humidity conditions. Therefore, it is needed to evaluate strength deterioration appropriately on each environmental condition. In this study, the strength deterioration tests of silicon glue on high-humidity conditions are conducted for the purpose of predicting strength deterioration caused by humidity. As the result, it is predicted that it takes about 50000 hours for the strength of the silicon glue to become 0.9 times as much as initial strength on 50℃ and 100% RH condition.
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© 2012 The Japan Society of Mechanical Engineers
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