The Proceedings of the Materials and Mechanics Conference
Online ISSN : 2424-2845
2013
Session ID : OS0102
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OS0102 Singular Stress Field of Small Edge Interface Crack under Thermal Stress
Kazuhiro ODATakayuki SHINMOTO
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Abstract
This paper deals with the analysis of the thermal stress intensity factor for small edge interfacial crack between a bonded dissimilar plates subjected to uniform change of temperature by using the crack tip stress method. In the present method, the stress values at the crack tip calculated by FEM are used under the same mesh pattern and the stress intensity factors are evaluated from the ratio of stress values at the crack-tip-node between a given and a reference problems. This method is based on the fact that the singular stress field near the interface crack tip is controlled by the stress values at the crack tip calculated by FEM. In this study, the small edge interface crack problem under thermal stress is solved by superposing the uniaxial tension problem with edge singularity and the problem subjected to temperature change and uniaxial compression with no edge singularity. The calculation shows that the stress intensity factors of the small edge interface crack under thermal stress can be evaluated from four constant factors related only to the Dunders' parameter.
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© 2013 The Japan Society of Mechanical Engineers
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