Abstract
A room temperature bonding technique namely Surface Activation Bonding (SAB) has studied on micro bonding application. In this technique, a stable oxide layer exists on a material surface is physically removed by Fast Atom Beam (FAB) irradiation in Ultra High Vacuum chamber, and then the bonding is accomplished by an atomic-order contact between two activated surfaces. In this study disscussed the posibility of lower cacuum conditino SAB process for large-scale structual materials. The SAB bonding tests using five kinds of nano-scale roughness mirror polished metals (Al, Fe, Ni, Zn and Cu). As the result, it was clarified that lower oxide formation and higher diffusion materials, Cu and Zn had good bondabilities. This result indicates that oxidation and diffusion are important factors of the bulk SAB. Moreover, the influence of exposure during SAB process was disscused. The bonding was successful up to 45 Pa・s exposured. This can be understood the bonding might be possible under lower vacuum condition. The possibility of the room temperature bonding for bulk structural materials was indicated.
