Abstract
We propose fabrication process of micronozzle array with flat tip and establish important part of the process. We demonstrate fabrication of through holes in a Si substrate. Fabricated holes were enlarged by about 3 μm from pattern on mask. Flatness of the tip region was preserved after the etching process. Height of nozzle was controlled by adjusting time of deep silicon etching. Cells were captured and released with a hole-substrate. A cell was captured with a φ5.5 μm nozzle at -50 kPa. With increasing hole diameter, cell internal entry rate increased. We succeeded in release of a cell after cell capture.
