Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 30, 2018 - November 01, 2018
This study investigates a new wiring technology for various materials without any surface treatment using plasma and electrically induced micro-bubbles. Our technology has three novelty points: (1) No requirement of complicated pre-surface treatment processes before wiring and which is unlikely to the electroless plating or conventional other method. (2) Resolution of the wiring can be reached to several tens micron with short time and low cost. (3) Robust metallic adhesion on wide range material was successfully carried out with precise positioning. For this time, we implanted nickel nanoparticles into rubber substrate with our method, and electrical conductivity of the created line. This result suggests our technology has a possibility to become new wiring technology. Precise, robust and simple electrical circuit can be fabricated without any complicated procedures and pre-treatment and which can be contribute to micro-fabrication technology.
