Host: The Japan Society of Mechanical Engineers
Name : [in Japanese]
Date : October 30, 2018 - November 01, 2018
Nanosilver particles have a strong potential to be one of the key materials for next generation bonding technique for power modules. In this study, tensile tests of sintered nanosilver films with different porosities were carried out to investigate the relationships between porosity, Young's modulus and breaking strain. The fracture mechanism was investigated.