The Proceedings of the Symposium on Micro-Nano Science and Technology
Online ISSN : 2432-9495
2018.9
Session ID : 31pm2PN82
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Development of an electrowetting device for thermal conductance control
*Kenshi KamadaTomohide YabukiKoji Miyazaki
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Abstract

In this study, we investigate thermal conductance switching characteristics using liquid metal gallium indium eutectic alloy. Gallium indium eutectic alloy was fabricated by mixing gallium and indium. Liquid metal is poured into the micro channel saturated with electrolyte aqueous solution which is driven by applying electric field and known as electrowetting. The filling rate of liquid metal in the action part can control thermal conductance. Thermal switching using electrowetting process shows that the value of thermal conductance ratio was about 1.2 using small channel and about 1.8 using big channel for our liquid metal. In the future, we will be developing high efficient device using MEMS technique.

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© 2018 The Japan Society of Mechanical Engineers
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