逆解析を用いた接着接合された構造体における接着部界面の応力分布推定法の開発

抄録

For evaluation of stress at the interface of the bonded part in previous studies, the singular stress field has been evaluated by the stress intensity factor and the singular stress index by finite element analysis. However the evaluation method of the actual stress distribution has not been established. It is necessary to estimate the stress generated in the bonded part without invasiveness. In this study, we propose a method to estimate the actual stress distribution generated at the interface of the bonded part by using the deformed shape data of the structure by finite element analysis based on the strain increment theory for the bonded body. A peeling test was conducted on a test piece in which a 0.3 mm thick aluminum plate (A1050) and a 5 mm thick aluminum plate (A2017), was adhesively bonded using a thermosetting epoxy adhesive sheet. The effectiveness of the proposed method was investigated.