The relationship between material properties and thermal fatigue cycle of lead free solder

Proceedings of the 1992 Annual Meeting of JSME/MMD

Online ISSN : 2433-1287

2003

DOI https://doi.org/10.1299/jsmezairiki.2003.0_611

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The relationship between material properties and thermal fatigue cycle of lead free solder

Hidehisa SAKAI, Masanori MOTEGI, Nobutaka ITO, Keiko KAWASE

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Keywords: Solder Joint, Thermal Cycle, BGA, Fatigue, FEM, Material constitutive law, Plastic, Creep

CONFERENCE PROCEEDINGS FREE ACCESS

Pages 611-612

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© 2003 The Japan Society of Mechanical Engineers

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