2016 年 65 巻 2 号 p. 170-175
Tensile tests were carried out for pure Al and its alloy thin films sputtered on Polyimide film. The effect of annealing temperature (at 200, 400 and 500℃) on deformation behavior was investigated. All thin films were fabricated by DC-Magnetron sputtering. Deformation behavior was measured using X-ray method. In Al-Ta-Si(A), (B) of non-annealed and 200℃ specimens, a relatively wide elastic region was observed. On the other hand the elasticity region was narrow for other materials. 0.2% proof stress of pure Al was almost constant irrespective of annealing temperature. For other materials, the value decreased with increasing annealing temperature. In that case, the grain size increased with annealing temperature for each material. In the case of pure Al, Al-Si and Al-Si-Ti, in all annealing temperatures, FWHM was almost constant in elastic region and increased when the plastic deformation occurred. On the other hand, in the case of Al-Ta-Si(A) and (B) of non-annealed specimen, the initial value of FWHM was high enough, and change of FWHM was not remarkable even in plastic region. For the relation between the proof stress and grain size, scatter was relatively large, however the high-strength tendency with decreasing grain size was confirmed. After tensile loading, intergranular cracks could be observed on a specimen surface for each material. Cracks initiated from splashes and large grains.