再結晶した銅多結晶における結晶粒方位差の分布およびΣ3+Σ3+Σ9粒界会合部の安定性

抄録

A plastically deformed copper bicrystal with a Σ9{221} grain boundary was annealed at 873K for 900sec and a copper polycrystal with an average grain size of 800μm was prepared. The orientation relationships of neighboring grains in the polycrystal after the recrystallization were measured by the back-reflection X-ray Laue method. The distributions of disorientation axes and angles of the grains were discussed using the coincidence-site lattice model. Many annealing twin boundaries with a Σ3 orientation relationship were observed in the polycrystal. Grain boundaries with Σ9 and Σ27 orientation relationships were observed in addition to the annealing twin boundaries, and the recrystallized structure was found to be dominated by the boundaries of Σ3ⁿ type. The orientations of Σ9 boundary planes were analyzed which formed Σ3+Σ3+Σ9 grain-boundary triple junctions with two Σ3{111} coherent twin boudaries. The stable orientations of the Σ9 boundaries corresponded to the planes where the plane density of coincidence-site lattice was high.