スマートプロセス学会誌
Online ISSN : 2187-1337
Print ISSN : 2186-702X
ISSN-L : 2186-702X
Ni-Sn 液相拡散を用いた半導体ダイアタッチ接合体の冷熱サイクル信頼性に与えるAl 中間層の効果
伊藤 宏文福本 信次藤本 公三
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ジャーナル フリー

2021 年 10 巻 1 号 p. 39-44

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Crack initiations induced by stress concentration in semiconductor chips jointed with high temperature bonding materials has been a critical problem to operate above 200℃. To solve the problem, an insertion of Al interlayer in a Ni-Sn transient liquid phase bonding layer(Ni-Sn TLPB/Al)has been proposed and the effect of stress reduction in the chip and enhance of high thermal durability of joint was clarified experimentally. In this study, we investigated an effect of Al interlayer and the thickness on stress in Si semiconductor chip(size: 5× 5 mm2, thickness: 200 mm)and strain in the Al interlayer of Ni-Sn TLPB/Al joint with DBC (Cu/Si3N4/Cu)or DBA(Al/Si3N4/Al)plate by finite element method(FEM)analysis. The result showed that the use of 150 mm thickness of Al interlayer enables to be lowest the stress at the edge of Si chip and strain in the Al interlayer of die-attach joint and were expected to enhance thermal cycle reliability at high temperature operations.

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