We investigated the influences of Pd film thickness of electroless Ni/Pd/Au plating on the solder ball joint reliability during reflow cycles and thermal aging, using high-speed solder ball shear test. As the solder ball, Sn-3.0Ag-0.5Cu solder ball was studied. After multiple reflow cycles and thermal aging, we found that the optimum thickness of Pd film with Sn-3.0Ag-0.5Cu solder ball was 0.05-0.2 μm.
