Recently, Power devices have gotten a lot of attention in order to achieve low power consumption and downsizing for electrical equipment. Under such conditions, power packages are strongly required to have high heat dissipation structure with low on-state resistance and low inductance to decrease low power loss and high-speed switching noise. Panel Level Package (PLPTM) gives advantages on productivity, reliability and high-speed transmission characteristics. In this paper, we observed temperature rise at a line and vias during applying current of over 100 A to understand their design in PLPTM. We also simulated temperature distribution of the same model to research thermal behavior and compared with observed result.
