表面科学
Online ISSN : 1881-4743
Print ISSN : 0388-5321
ISSN-L : 0388-5321
特集: さまざまな場面で活躍する剥離・接着技術
Si ナノ密着層による高分子フィルム・ガラスの接合と分離
須賀 唯知
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2017 年 38 巻 2 号 p. 67-71

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A method for debonding polyimide film and ultra-thin glass from glass substrate is proposed. The method is based on the surface activated bonding approach extended to a modified bonding process using Si nano-adhesion layer. The surfaces of both polyimide film and the glass substrate are activated by Si nano-adhesion layer deposited in vacuum and bonded in situ at room temperature whereas only the ultra-thin glass surface is treated with Si nano-adhesion layer, and bonded in vacuum to glass substrate after exposure to N2 gas. Even after a thermal treatment such as TFT process over 400 to 500°C, they can be debonded by mechanical peeling at room temperature.

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この記事はクリエイティブ・コモンズ [表示 - 非営利 4.0 国際]ライセンスの下に提供されています。
https://creativecommons.org/licenses/by-nc/4.0/deed.ja
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