The Development of Printed Circuit Board by Aramid

Abstract

Aramid has excellent properties such as low density, high tensile strength, high tensile modulus, low moisture content and few impure ion which affect electrical properties, in addition, this fiber has negative thermal expansion coefficient (TEC).
As Aramid has negative value of TEC, the epoxy laminates reinforced by Aramid have sufficiently low TEC and low electromigration suitable for printed circuit board. Laminates reinforced by Aramid show excellent laser-drilling performance because of uniform impregnation of resins.
This report presents the properties of rigid printed circuit board made of epoxy composite reinforced by Aramid in comparison with that of the other kind of fibers.