Journal of the Vacuum Society of Japan
Online ISSN : 1882-4749
Print ISSN : 1882-2398
ISSN-L : 1882-2398
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高真空スパッタと超臨界 CO2 を用いた微細孔の埋め込み
伊藤 勝利沼川 智則大野 泰典寺崎 雅人前田 優樹宇原 祥夫大竹 勝人斉藤 茂
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2011 年 54 巻 3 号 p. 173-176

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  Two methods of copper (Cu) filling into through-holes and trenches with various barrier metals were investigated: high-vacuum magnetron sputtering and the supercritical carbon dioxide method. In spite of good Cu-filling by using the supercritical carbon dioxide method, adhesion of the Cu films to the barrier metals worsened with relative resistivity. Examples of Cu-filling by both high-vacuum magnetron sputtering and the supercritical carbon dioxide method for obtaining good adhesion to the barrier metals are shown.

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© 2011 一般社団法人日本真空学会
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