2011 年 54 巻 3 号 p. 173-176
Two methods of copper (Cu) filling into through-holes and trenches with various barrier metals were investigated: high-vacuum magnetron sputtering and the supercritical carbon dioxide method. In spite of good Cu-filling by using the supercritical carbon dioxide method, adhesion of the Cu films to the barrier metals worsened with relative resistivity. Examples of Cu-filling by both high-vacuum magnetron sputtering and the supercritical carbon dioxide method for obtaining good adhesion to the barrier metals are shown.