Journal of the Vacuum Society of Japan
Online ISSN : 1882-4749
Print ISSN : 1882-2398
ISSN-L : 1882-2398
技術紹介
スパッタリングプロセスにおける静的圧力分布,および動的圧力変化の実測
田尻 修一大西 孝則岡野 夕紀子小川 倉一美馬 宏司
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2017 年 60 巻 6 号 p. 220-227

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 It is extremely important to measure and control the dynamic behavior of the pressure distribution and gas flows near the substrates inside the vacuum process facility. However, it has been rarely accomplished with existing vacuum sensing technology. The authors developed an ultra-small thin film micro pressure sensor using TaAl-N thin film as sensing element, and measured the local pressure distribution at steady state near the target and near the substrate in the sputtering system. Furthermore, continuous measurement of the dynamic pressure variations during the reactive sputtering process was successfully conducted to improve the fabrication quality and productivity in the vacuum fabrication systems.

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