Host: The Japan Society of Vacuum and Surface Science
The down-scaling of integrated circuits is approaching economical and technological limits, and thus diversification is expected as another growth direction, so called “More than Moore”. For the diversification of microelectronics, integration with other kinds of components, i.e. heterogeneous integration, is one of promising approaches. This paper reports wafer-level heterogeneous integration and packaging technologies based on a wafer-to-wafer bonding process which enable the combination of dissimilar materials and components into single systems and hermetic packaging at a same time.
