Preprints of the National Meeting of JWS
the national meeting 2007 autumn
Session ID : 353
Conference information

Host: Japan Welding Society

Investigation of bonding mechanism using Ag nanoparticles.
*Yusuke Akada, Hiroaki Tatsumi, Takuto Yamaguchi, Akio Hirose, Toshiaki Morita, Eiichi Ide
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Keywords: Ag nanoparticle, bonding, Lead-free solder, sintering
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Abstract
We have proposed a novel bonding process using Ag nanoparticles, which can be alternative to lead-rich high melting point solder. The bonding mechanism of Ag metallo-organic nanoparticles to bulk materials is discussed based on the observations of the bonded interface using TEM.
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© 2007 by Japan Welding Society
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