[volume title in Japanese]
Conference information
Name : [in Japanese]
Location : [in Japanese]
Date : April 14, 2021 - April 19, 2021
Microstructure evolution of stranded Cu Wires in ultrasonic welding process
*Ryotaro HORIUCHI, Chihiro IWAMOTO, Shigeo SATO, Seriya KOMAI, Tomoya ISHITUKA, Hirohumi TAKAO, Yoichi HASHIMOTO, Kensuke HAMADA
Author information
Keywords:
stranded wire,
ultrasonic welding,
wedge bonding,
electron back scattered diffraction pattern,
Cu wire
Pages 50-51
Details
