き裂面ソルダリングによる疲労き裂進展制御

抄録

Retardation behavior of fatigue crack growth due to crack surface soldering was investigated experimentally in a low-alloy steel. The flux-cored solder wires located within an initial notch were heated to above melting temperature. When a crack was opened by loading, liquid solder easily infiltrated up to the crack tip by a capillary phenomenon. By unloading subsequent to cooling to room tempeature, an artificial wedge was formed between the crack surfaces. This crack surface soldering has a preferable effect on fatigue crack growth control. When the crack-opening load during crack surface soldering is equal to the maximum load of fatigue cycling, the fatigue crack is arrested.