樹脂モールド時残留応力の数値解析 : 第1報, 硬化後冷却時に発生する応力と変形の粘弾性解析

抄録

A computer program to analyze residual stress and deformation, which occur by cooling after the curing process of resin-molded products, is developed. Visco-elastic behavior of the resin is simulated in this program. This program enables simple analysis of the molded body of a complicated three-dimensional shape because (1) it uses approximation with exponential function of the relaxation modulus, (2) it applies this approximation to the creep finite-element method, (3) it uses the effective stress function method. Comparative experiments, using test pieces of molded metals to confirm the performance of this program, showed that the deformation of the test pieces during cooling after curing agreed well with the calculated results.