New lap joint type shear specimen has been proposed to measure creep deformation properties of solder using for printed circuit board (PCB). The specimen has the following characters. The solder joint is fabricated easily by reflow soldering which is the same as surface mounting process of PCB and is kept in nearly pure shear stress state at any loading level onto the specimen. Additionally, the specimen is tested easily by utilizing usual Instron type testing machine. The experimental results of creep tests for Pb/Sn eutectic solder were compared with data shown in the literature. Consequently, the validity of the specimen was confirmed through the fact that the creep deformation properties were obtained with sufficient accuracy. Furthermore, the specimen was applied to the creep tests of some kinds of Sn/Pb solder with high thermal fatigue strength. The creep deformation properties of the solder were evaluated in comparison with the properties of Sn/Pb eutectic solder. As a result, the solder shows relatively small amount of creep deformation, namely, lower minimum creep strain rate in steady state creep.