78 巻 (2012) 793 号 p. 1550-1559
In order to achieve higher heat transport performance for electronic power device cooling, a two-phase heat transport device with parallel tubes, which consisted of several thin tubes connecting cooling- and heating-headers, was developed and its performance was experimentally tested. The performance of the parallel-tube heat transport device was higher than that of the meandering closed loop heat transport device of self-existing mode oscillating flow. In this study, in order to clarify the effects of various parameters on the heat transport performance, experiments were performed by varying the following parameters: working fluids, filling ratio, number of tubes, tube diameter and length, header diameter, and temperature difference between heating and cooling headers. In addition to the heat transfer experiments using copper circular tubes, flow visualization experiments were performed using square channels grooved on a plate. These results show a detail of the parallel-tube heat transport device performance. The heat transport limit occurred by dry-out in the heating header.