低圧トランスファ成形用エポキシ樹脂の円管内流動解析

抄録

A method for analyzing mold filling dynamics of thermosets in a circular channel has been developed. A constitutive equation model to describe isothermal viscosity changes of commercial molding compounds was derived as a function of time and temperature. This model was used for predicting actual nonisothermal viscosity changes. The simultaneous equations, including the conservation equations of total mass, momentum and energy, and the constitutive equation model were solved numerically to obtain rheological changes of an epoxy compound during mold filling in a circular channel. The calculated profiles of apparent mean viscosity with time of the epoxy compound corresponded well with the experimental data.