スパッタ法における孔付きターゲットによるコリメーション効果の数値解析

抄録

A sputtering apparatus with a multiholed target, which has a large number of small holes on its surface, is proposed for the improvement of step coverage in a contact hole. The step coverage depends on the depth h of the hole drilled in the target and the deposition probability P_C on the side wall of the hole. The bottom wall coverage of the contact hole is improved considerably by the use of the multiholed target. The optimum aspect ratio is h/d=1.0∼1.5, where d is the diameter of the hole.