抄録
High-speed optical interconnects have been attracting much attention in data centers and edge computing
networks for saving power consumption by reducing electrical link lengths. A VCSEL is a key component
in hyperscale data centers and supercomputer networks because of fascinating properties that provide
high-speed operations, low-power consumption, a small footprint, wafer-scale testing, low-cost
packaging, and ease of fabrication into arrays. In particular, a VCSEL solution gives us high-speed and
low-power consumption, which satisfy requirements. We started the NICT project toward high-speed
and low-power consumption, co-packaged optics transceivers based on VCSEL arrays and multi-core fibers
(MCFs) for delivering the advantages of power consumption and capacity density per module. In
this paper, we present our recent activity on high-speed transverse-coupled-cavity (TCC) VCSEL arrays
for co-packaged optics. We developed a single-mode, 1060-nm metal-aperture VCSELs array, which offers
a high density I/O platform with a multi-core fiber.
