MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Interfacial Reactions Between Sn-58 mass%Bi Eutectic Solder and (Cu, Electroless Ni-P/Cu) Substrate
Jeong-Won YoonChang-Bae LeeSeung-Boo Jung
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2002 Volume 43 Issue 8 Pages 1821-1826

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Abstract

The growth kinetics of intermetallic compound layers formed between eutectic Sn–58Bi solder and (Cu, electroless Ni–P/Cu) substrate were investigated at temperature between 70 and 120°C for 1 to 60 days. The layer growth of intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P system satisfied the parabolic law at given temperature range. As a whole, because the values of time exponent (n) have approximately 0.5, the layer growth of the intermetallic compound was mainly controlled by diffusion mechanism over the temperature range studied. The apparent activation energies of Cu6Sn5 and Ni3Sn4 intermetallic compound in the couple of the Sn–58Bi/Cu and Sn–58Bi/electroless Ni–P were 127.9 and 81.6 kJ/mol, respectively.

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© 2002 The Japan Institute of Metals and Materials
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