MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Mechanism and Prevention of Spontaneous Tin Whisker Growth
King-Ning TuJong-ook SuhAlbert Tzu-Chia WuNobumichi TamuraChih-Hang Tung
Author information
JOURNALS FREE ACCESS

2005 Volume 46 Issue 11 Pages 2300-2308

Details
Abstract

Spontaneous Sn whisker growth on Cu leadframe finished with Pb-free solder is a serious reliability problem in electrical and electronic devices. Recently, Fortune magazine had an article to describe the urgency of the problem. The spontaneous growth is an irreversible process, in which there are two atomic fluxes driven by two kinds of driving force. There are a flux of Cu atoms and a flux of Sn atoms. The Cu atoms diffuse from the leadframe into the solder finish driven by chemical potential gradient to form intermetallic compound of Cu6Sn5 in the grain boundaries of the solder, and the growth of the compound at room temperature generates a compressive stress in the solder. To relieve the stress, a flux of Sn atoms driven by the stress gradient diffuses away to grow a spontaneous Sn whisker which is stress-free. The typical industry solution is to insert a diffusion barrier of Ni between the Cu and solder to prevent the diffusion of Cu into the solder. It is insufficient, because we have to uncouple the irreversible processes and stop both the fluxes of Cu and Sn. A solution is presented here.

Information related to the author
© 2005 The Japan Institute of Metals and Materials
Next article
feedback
Top