MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Interfacial Reaction between Sn–Ag–Co Solder and Metals
Hiroshi NishikawaAkira KomatsuTadashi Takemoto
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2005 Volume 46 Issue 11 Pages 2394-2399

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Abstract

In order to clarify the effect of the addition of Co to Sn–Ag solder on the interfacial reaction between solder and metals, the reaction between solder and metals, such as plated Fe and Cu, has been investigated. Sn–3.5 mass%Ag–xCo solders (x=0, 0.1, 0.3, 0.5 and 1.0 mass%) was specially prepared in this study. A reaction test between the solders and plated iron was performed at 723 K for 32.4 ks by using an oven in a normal air to mainly investigate the effect of the addition of Co to solder on the dissolution thickness of plated iron. And then a reaction test between solder and a Cu substrate was carried out to investigate the effect of the addition of Co to solder on the wettability of solder and the formation of intermetallic compound at the interface. For the reflow process, specimens were heated in a radiation furnace at 523 K for 60 s and, for the aging process, some specimens were heat-treated in an oil bath at 423 K for 168 h and 504 h. As a result of the reaction test between the solder and plated iron, it was found that the addition of Co to Sn–3.5Ag solder was certainly effective to reduce the dissolution thickness of plated iron. Then as a result of the reaction test using Cu substrate, it was clear that there was little effect of the addition of Co on the wettability of solder and Sn–3.5Ag solder added minor Co was certainly effective to reduce the growth rate of the intermetallic compound at the aging process.

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© 2005 The Japan Institute of Metals and Materials
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