MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Reactivity between Sn–Ag Solder and Au/Ni–Co Plating to Form Intermetallic Phases
Takashi YamamotoShigeaki SakataniShinji KobayashiKeisuke UenishiKojiro F. KobayashiMasaaki IshioKazuhiro ShiomiAkio HashimotoMasaharu Yamamoto
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2005 Volume 46 Issue 11 Pages 2406-2412

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Abstract

For the formation of micro joint not to melt by secondary reflow soldering, we tried to enhance the reactivity of Sn–Ag solder with Au/Ni–20Co plating. It was confirmed that the addition of Co in Ni and existence of Au plating effectively accelerated the reaction and the Sn–Ag solder completely transformed to the intermetallic compounds with a higher melting temperature.
Particularly, the addition of Co in Ni changed the interfacial reaction layer from Ni3Sn4 to (Ni,Co)Sn2 with higher diffusivity of Ni which enhanced the formation of the intermetallic phases. This process is expected to replace the packaging technology using high temperature solders.

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© 2005 The Japan Institute of Metals and Materials
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