MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
ISSN-L : 1345-9678
Texture of Electroplated Copper Film under Biaxial Stress
Bo HongChuan-hai JiangXin-jian Wang
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2006 Volume 47 Issue 9 Pages 2299-2301

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Abstract

The stresses and the textures of electroplated copper films were studied using the X-ray diffraction analysis. The results show that the stresses in the films are always tensile. The films have (110) fiber texture at different thickness from 8 to 60 μm. From strain energy minimization point of view, the grains with (110) orientation should be favorable in these films. A further planar texture on top of the fiber texture was developed. It could be explained by elastic anisotropy at different orientation in grain.

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© 2006 The Japan Institute of Metals and Materials
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