Properties of Soldering Cu/Fe Alloy Produced by Powder Metallurgy

Hidekazu Sueyoshi; Ryosuke Ishii; Hisayoshi Fukudome; Shinji Mizokuchi; Toshio Wakabayashi; Kazuya Saikusa

doi:10.2320/matertrans.MRA2008112

Hidekazu Sueyoshi, Ryosuke Ishii, Hisayoshi Fukudome, Shinji Mizokuchi, Toshio Wakabayashi, Kazuya Saikusa

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Keywords: lead-free solder, copper/iron alloy, powder metallurgy, wettability, thermal conductivity

JOURNAL FREE ACCESS

2008 Volume 49 Issue 12 Pages 2881-2886

DOI https://doi.org/10.2320/matertrans.MRA2008112

View "Advance Publication" version (November 12, 2008).

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Abstract

In order to develop an advanced soldering material, the Cu/Fe alloys were produced by using powder metallurgy and the soldering properties were examined. Thermal conductivity of Cu/Fe alloy decreased with the increase in the volume fraction of pores, while it increased with the increase in the volume fraction of Cu particles. Wettability of Cu/Fe alloy was better than that of conventional Fe plating. Comparing the consumption amounts under the same wettability, the amount of Cu/Fe alloy consumed was smaller than that of Fe plating consumed.

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