MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Strain Rate Dependence on Nanoindentation Responses of Interfacial Intermetallic Compounds in Electronic Solder Joints with Cu and Ag Substrates
Jenn-Ming SongYu-Lin ShenChien-Wei SuYi-Shao LaiYing-Ta Chiu
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2009 Volume 50 Issue 5 Pages 1231-1234

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Abstract

This study evaluated mechanical behavior of the intermetallic compounds (IMCs) formed at the interfaces between potential Pb-free solders (Sn-Ag-Cu and Sn-Zn) and the wires of Cu and Ag under different loading rates. Compared to Ag based IMCs, Cu based IMCs were harder and stiffer, but less strain rate sensitive. The morphology of the indent impression was found depending on the ratio of the modulus to hardness, and the crystal structure of the IMCs.

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© 2009 The Japan Institute of Metals and Materials
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