MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Electron Backscatter Diffraction Characterization of Microstructure Evolution of Electroplated Copper Film
Su-Hyeon KimJoo-Hee KangSeung Zeon Han
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2010 Volume 51 Issue 4 Pages 659-663

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Abstract

The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general high-angle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning.

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© 2010 The Japan Institute of Metals and Materials
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