2010 Volume 51 Issue 4 Pages 659-663
The microstructure evolution of electroplated copper films was characterized by electron backscatter diffraction (EBSD). Special care was taken during the preparation of the cross-sectional specimens and microstructure analysis to obtain reliable results. The film exhibited a columnar grain structure with a large fraction of twin boundaries. Annealing induced normal grain growth and caused many of the general high-angle grain boundaries to be replaced by twin boundaries, possibly by annealing twinning.