2013 Volume 54 Issue 10 Pages 2059-2063
A novel repair method of carbon fiber reinforced plastics (CFRPs) has been developed by means of our novel technology based upon the thermal activation of oxide semiconductors (TASC). TASC means the appearance of significant catalytic effects when the semiconductor is heated at about 350–500°C. This technology allows us to remove the polymer matrix alone in damaged areas of CFRP in the presence of thermally activated semiconductors while retaining the embedded fibers intact. The polymer-eliminated area is then refilled with an epoxy resin to complete the repair. In parallel, characterization of the carbon fiber has also been carried out by optical microscope, scanning electron microscope (SEM), X-ray diffraction (XRD), as well as thermogravimetric analysis and differential thermal analysis (TGA/DTA). The analysis revealed that no noticeable deterioration of the carbon fiber is recognized, but the sizing agent for the fiber is found to be eliminated by TASC.