MATERIALS TRANSACTIONS
Online ISSN : 1347-5320
Print ISSN : 1345-9678
Metal–Metal Bonding Process Using Cu+Ag Mixed Nanoparticles
Jianfeng YanGuisheng ZouYingchuan ZhangJiaxin LiLei LiuAiping WuY. Norman Zhou
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2013 Volume 54 Issue 6 Pages 879-883

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Abstract

The Cu+Ag mixed nanoparticles were prepared based on the chemical reduction method. The polymer coated on the Cu+Ag mixed nanoparticles can protect Cu nanoparticles from oxidation. The metal–metal joint of silver plated Cu bulks was investigated with the use of Cu+Ag mixed nanoparticles. The bonding experiments show that joint with shear strength about 20 MPa was formed at the bonding temperature above 250°C under 5 MPa using Cu+Ag mixed nanoparticles. The strength of bonding using Cu+Ag mixed nanoparticles is lower than that of bonding using pure Ag nanoparticles. This may be due to the fact that the sintering between the Cu nanoparticles and Ag nanoparticles is more difficult than the sintering between Ag nanoparticles.

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© 2013 The Japan Institute of Metals and Materials
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